ULS-12/2.5-D48N-C【PDF 28/30 页】36-75VIN 12VOUT 30W NEG LOGIC

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ULS 30-Watt Series

Sixteenth-brick DOSA-Compatible,

Isolated DC/DC Converters

Trimming by Using an External Voltage Source

1. The easiest way to trim the output using an external voltage source is to

drive the Trim pin directly from a variable source. The following equation can

+VIN

+VOUT

be used to calculate the voltage at the Trim pin.

+SENSE

External

source

Vtrim = 2 x 1.24 x

Vo

Vonominal

? 1.24

ON/OFF

CONTROL

TRIM

+

–

LOAD

Vo is the output voltage you want; Vonominal is the nominal output voltage;

–SENSE

Vtrim is the voltage that should appear at the trim pin.

2. If the purpose of trimming is to compensate voltage drop of power path

from converter to the Load, you may separately connect the sense pin directly

to the load. It’s much easier than real time adjusting trim voltage.

3. CAUTION: To avoid unplanned power down cycles, do not exceed EITHER

the maximum output voltage OR the maximum output power when setting

the trim. If the output voltage is excessive, the OVP circuit may shut down the

converter. If the maximum power is exceeded, the converter may enter current

limiting. If the power is exceeded for an extended period, the converter may

overheat and encounter overtemperature shut down. Be careful of external

electrical noise. The Trim input is a sensitive input to the converter’s feedback

control loop. Excessive electrical noise may cause instability or oscillation.

–VIN

–VOUT

Figure 8. Trimming with an external source

Through-hole Soldering Guidelines

Murata Power Solutions recommends the TH soldering speci?cations below when install-

ing these converters. These speci?cations vary depending on the solder type. Exceeding

these speci?cations may cause damage to the product. Your production environment may

differ; therefore please thoroughly review these guidelines with your process engineers.

Wave Solder Operations for through-hole mounted

products (THMT)

For Sn/Ag/Cu based solders:

SMT Re?ow Soldering Guidelines

The surface-mount re?ow solder pro?le shown below is suitable for SAC305 type lead-

free solders. This graph should be used only as a guideline . Many other factors in?uence

the success of SMT re?ow soldering. Since your production environment may differ,

please thoroughly review these guidelines with your process engineers.

Maximum Preheat Temperature

Maximum Pot Temperature

Maximum Solder Dwell Time

For Sn/Pb based solders:

Maximum Preheat Temperature

Maximum Pot Temperature

Maximum Solder Dwell Time

115° C.

270° C.

7 seconds

105° C.

250° C.

6 seconds

www.murata-ps.com/support

MDC_ULS-30W_C06 Page 28 of 30

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